We offer fabrication and customization services for semiconductor die components, including:
-IC encapsulation die cavities and inserts
-IC leadframe stamping die punches and bushings
-Semiconductor packaging die plungers and pots, -Semiconductor packaging die plungers and pots
-Encapsulation die cores and core pins

Materials: tungsten carbide, technical ceramics, tool steel, HSS, ASP23, etc.