IC Package Mold Parts Cavities and Inserts
We offer fabrication and customization services for semiconductor die components, including:
-IC encapsulation die cavities and inserts
-IC leadframe stamping die punches and bushings
-Semiconductor packaging die plungers and pots, -Semiconductor packaging die plungers and pots
-Encapsulation die cores and core pinsMaterials: tungsten carbide, technical ceramics, tool steel, HSS, ASP23, etc.
Injection Moulding for Sophisticated Plastic Optical Components
We supply mould components for the optical sector, including injection moulding tools and moulds, microfluidic components, silicone optical injection mould components, mould components for optical components for automotive headlamps, sensor optical mould cores and inserts, cavities and core pins for micro-optical moulds for camera systems, mould punches and bushings for LED lighting systems, etc.
Material: 1.2343/1.2344/HSS/SKD11/SHH51/M42/M2/ASP23/Tungsten Carbide/Technical Ceramics/Beryllium Copper etc.
