We supply mould components for semiconductor packaging, integrated circuits, they are completed with carbide, technical ceramics, hardened tool steel.
Typical products:
Strip Cavity
Pot & Plunger
Ejector Pins
Cavity QFP
Cavity - T2R
Cavity - SFLAT
Cavity - QFN
Cavity - ESOP
Tungsten Carbide Speciality Inserts
Mould Inserts
Punch & Matrix
Guidance elements, etc.