Custom Machining Pot & Plunger for Semiconductor Packaging
The company is one of the largest manufacturers of Pot & Plunger in China and we provide OEM services for Pot & Plunger to well-known semiconductor companies in China and Taiwan.
Pot & Plunger is used in the manufacture of semiconductor packaging moulds. The company's Pot & Plunger can be manufactured using M42 high speed steel or tungsten carbide and can also be supplied with additional PVD coating services.
OEM/ODM Pot & Plunge for semiconductor packaging mould manufacturing
Made from drawings
Applications and semiconductor packaging tools
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Can be used in conjunction with automatic encapsulation systems to improve the intrinsic quality of the product.Semiconductor Pot & Carbide Plunger Manufacturers
The company is a manufacturer of the semiconductor Pot & Plunger, which is finished in tungsten carbide and is manufactured and customised according to drawings
IC Package Mold Parts Cavities and Inserts
We offer fabrication and customization services for semiconductor die components, including:
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-Semiconductor packaging die plungers and pots, -Semiconductor packaging die plungers and pots
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SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
