IC Package Mold Parts Cavities and Inserts
We offer fabrication and customization services for semiconductor die components, including:
-IC encapsulation die cavities and inserts
-IC leadframe stamping die punches and bushings
-Semiconductor packaging die plungers and pots, -Semiconductor packaging die plungers and pots
-Encapsulation die cores and core pins
Materials: tungsten carbide, technical ceramics, tool steel, HSS, ASP23, etc.
We manufacture IC packing mold parts from drawings，
-Forming frames
-cavity blocks
-top cavity blocks
-BGA mould holders
-hot runner plates
-IC cavities and inserts
-semiconductor hot runner gating moulds, etc.
Machining services such as WEDM and EDM on request
Semiconductor mould components are mainly used in the following areas:
-Numerical sealing (molding) dies
-IC packaging moulds
-Electronic component moulds
-Leadframes for transistors and diodes
-Trimming/forming dies
-Semiconductor IC leadframe stamping dies
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SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
