Semiconductor MGP Mold Die Machining
Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multiple cans and plungers. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
Applicable package types:
1. QFP, LQFP, TSOP, PLCC, SOT, SOD series;
2. Matrix SOP, SSOP, TSSOP series;
3. SMD tantalum, SMD sensing and DIP, TO, etc. with high requirements;
4.DIP and SDIP series
Application: mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multi-can and multi-plunger. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
-. Balanced filling and high quality
-. Quick-change moulded parts
-. Fast curing compounds use
-. Suitable for all types of packaging
-. Solutions for venting and gate design to ensure good moulding
performance (voids, swept lines and incomplete filling).
-. Minimising the use of compounds
-. Individual chasing X-Y positioners on the top and bottom four sides
-. Standard material: ASP23
-. Pot and plunger head: T.C
-. Chase interlock design: Misalignment <1.5
-. T.C Gate insertion design
-. E-J pins without crown flash
-. Heat loss cover: Teflon cloth (blanket) / DuPont Nomex - T994
For semiconductor manufacturing
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