IC Packaging Mold Cavity Bar and Auto Mold Chase
Application: Suitable for TOWA, FICO, ASM, HANMI brand AUTO MOLD SYSTEM
Can be used in conjunction with automatic encapsulation systems to improve the intrinsic quality of the product.
We manufacture AUTO MOLD for semiconductor packaging moulds and offer the manufacture of special parts for moulds.
-MOLD CHASE
-IC packing molds
-Cavity bar
-BTM cavity block
-DIP sliding cover
-Runner plate
-Base of BTM cavtiy bar
-Auto mold chase
-QFN package mold insert
-Molded insert TO247
-SOT mold for semiconductor packaging
-Molded insert for semiconductor packaging die (top)
-Forming cavity (insert) under semiconductor package
-Mould inserts
-Molded insert in semiconductor package (TO92)
-Die box for mould sealing of semiconductor and integrated circuit
-Semiconductor gate runner mold
-Gate runner mold etc.
Manufacture of semiconductor tools from drawings
Semiconductor Manufacturing
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