Semiconductor Leadframe Tooling Stamping Punches
Many different types of leadframes are used in semiconductor devices, and SPP INDUSTRY designs and manufactures molds, assembles stamping dies, and mass produces and supplies a variety of high precision and quality leadframes and stamping die components.
The company is a manufacturer of semiconductor leadframes and we are also one of the largest manufacturers of leadframe stamping tooling components in China.
Punching widths as small as 50 μm
The stamping tooling is a clever assembly of self-developed high-precision parts.
SPP INDUSTRY meets all customer needs with advanced tooling development/manufacturing and mass production stamping technology.
For all your leadframe needs
LSI, transistors and diodes.
Leadframes for semiconductor devices are becoming more and more diverse and complex. At SPP INDUSTRY, we handle everything from mold design and manufacturing to assembly and leadframe production for volume production, and provide mold component manufacturing services for leadframes.
Manufacture leadframes and semiconductor leadframe mold parts according to drawings
Leadframes for semiconductors such as LSIs, transistors, and diodes.
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